TIE-2019





1st International Conference on Emerging Trends in Engineering, Innovative Science and Management (ICETEISM -2019) 
In association with
Technical Institute for Engineers



 


About

About East West Institute of Technology

East West Group of Institutions, a well-known and a prominent educational institution crowns an absolute place among the top colleges in Bengaluru. EWGI upholds its unflinching recognition in all respects of academics and is celebrating 50th year of Academic Excellence, honing the life of every student with a code of conduct. EWGI offers vivid programs such as Engineering, Architecture, Science & Commerce, Management, Pharmacy, Polytechnic, Nursing, etc. East West Institute of Technology established in 2001 with the prime moto to serve the best quality based on technical education and the campus is advantageously located in a well-known green city of Bengaluru and has an extensive vicinity of 20 acres of land surrounded with congeal and pleasant learning atmosphere.

About Technical Institute for Engineers

Technical Institute for Engineers (TIE) acts as a platform by providing support and help in learning advance in technical education and research & development for the members to meet the current demands in the field of education and research. We’re constantly exploring, evolving, adapting and growing with technologies and expanding our capabilities to establish a society where everyone can learn and grow, irrespective of where they are in their career path. We prepare you for the opportunities at hand and the bigger ones down the road.

About ICETEISM

1st International Conference on Emerging Trends in Engineering, Innovative Science and Management (ICETEISM -2019)  will provide an excellent international forum for knowledge concerning topics and technologies related to Innovation in Engineering & Technology. Our aim is to promote a high quality research by bringing together researchers, scientist, experts and practitioners from academia and industry to provide them an exclusive platform for sharing worldwide ideas and innovative development on engineering and Technology.

Call for Papers

Research Papers are Invited in the following domain of Interest, but not limited to

Civil & Environmental Engineering
  • Ecological engineering
  • Ecosystems
  • Fire protection engineering
  • Sanitary engineering
  • Wastewater engineering
  • Environmental engineering
  • Wastewater treatment
  • water reclamation and waste management
  • Mining engineering
  • Wind engineering
  • Architectural engineering
  • Ocean engineering
  • Structural engineering
  • Transport & Traffic engineering
  • Railway systems engineering
  • State Space Search
  • Statistical Data Analysis
  • Support Vector Machines
Business Administration
  • Overcoming Negative Emotions at Your Workplace
  • Microeconomics, Public Policy & Political Economy
  • Changing Organizational and HR practices
  • Foreign Direct Investment & Internationalization
  • Stockholder Vs Stakeholders Approach to Management
  • Impact of Economic Environment of SMEs
  • Trends & Challenges in Banking & Financial Services
  • Changing Environment: Marketing , Distribution and Trade
  • Financial Inclusion: Challenges & Opportunities
  • Emerging Issues in Finance
  • Gender Diversity and Gender Equity
  • Disruptive Innovation
  • Entrepreneurship & Family Business Emerging Needs of Efficient Manufacturing & Service Operations
  • Transformation & Structured Management Practices
  • Entrepreneurship, Growth and Competitiveness
Applied Sciences
  • Artificial Intelligence, Architecture, Astronomy
  • Ecology, Marine Science, Physics, Space Sciences, Life sciences
  • Computer Sciences, Logic, Mathematics, Statistics, Systems Science
  • Electrical Engineering, Information Technology
  • Electronics Engineering, Instrumentation Engineering
  • Industrial Engineering, Mechanical Engineering, Applied Physics
  • Health Sciences and Medicine, Ceramic engineering
  • Computing technology, Electronics, Energy
  • Environmental Engineering Sciences, Engineering physics
  • Environmental technology, Fisheries science
  • Micro technology, Nanotechnology, Nuclear technology
  • Computer-aided design, manufacturing, and engineering
Mechanical & Metallurgical Engineering
  • Acoustical engineering
  • Manufacturing engineering
  • Thermal engineering
  • Sports engineering
  • Vehicle engineering
  • Power plant engineering
  • Energy Engineering
  • Metals and alloys Studies
  • Microwaves and Metals studies
  • Material engineering studies.
Material Science
  • Advances in nanomaterials science
  • Alloys and coatings
  • Applications of biomedical materials
  • Atomic molecular and laser physics
  • Battery materials
  • Big data in materials science
  • Bio-energetics
  • Bio-glass
  • Bio-inorganic nanomaterials
  • Biomedical manufacturing
  • Carbon nanotubes
  • Casting and solidification
Electrical & Electronics Engineering
  • Electricity, Electronics, Electromagnetism
  • Digital computers
  • Power engineering
  • Telecommunications
  • Control systems
  • Radio-frequency engineering
  • Signal processing
  • Instrumentation and microelectronics
  • Control engineering
  • Modeling of dynamic systems
  • Design of controllers using electrical circuits
  • Digital signal processors and microcontrollers
  • Optical engineering
  • Image and Video Processing
  • Bio Medical Engineering
Computer Science & Soft Computing Topics
  • Applied computing
  • Bio-engineering, Bio-medical engineering
  • GIS
  • Algorithms & Analysis
  • Artificial intelligence
  • Chaos theory
  • Complex analysis
  • Computational statistics
  • Computer architecture
  • Computer security
  • Computer vision
  • Control theory
  • Data analysis
  • Databases
  • Data mining
  • Data structures
  • Distributed computing
  • Game theory
  • Graph theory
  • Grid computing
  • Human-computer interaction
  • Information retrieval, Internet of Things
  • Linear programming
  • Machine learning
  • Parallel computing
  • Quantum computing
  • Software engineering
  • Theory of computation
  • Wireless computing
  • Bioinformatics
  • Computational biology
  • Cryptography & Cybernetics
*********************

Committees

Chief Patrons

 

Patrons

 

General Chair

 

Technical Program Chair

 

Organizing Chair:

 

Advisory Committee:

 

Review Committee:

 

Organizing Committee:

Important Dates

Call of Paper 08 April 2019
Deadline for Full Paper submission 05th May 2019 extended to 15th May 2019
Notification of Acceptance 15 May 2019
Deadline for Registration 15 May 2019
Conference 18 May 2019

Paper Submission & Publication

It is planned to publish the peer reviewed and selected papers of the Conference as
Proceedings with International Journal of Engineering and Science Research(IJESR)


ISSN:2277-2685
ISSN:2320-9763

 

Authors are invited to submit full paper which should be drafted in English with a maximum of Eight (8) pages and minimum of 4 pages including figures, tables and references as per the given IEEE format given below.

Plagiarism Policy:

Dear Author(s), We wish to inform you that plagiarized papers will not be accepted for ICETEISM. The conference team will be checking plagiarism level of all the submitted papers for ensuring the originality of content using plagiarismcheckerX, Turnitin or iThenticate. Hence, you are advised to use a tool like “plagiarismcheckerX, Turnitin, iThenticate, Viper, PlagScan etc”. to check the plagiarism level of your manuscripts before submission.

Authors are kindly invited to submit papers electronically to through following link.

Click here for Paper Submission
 
Paper Template
Brochure

Registration

Category Fee
Students/Research Scholars / Faculty Members र. 2000
Delegates from Industry र. 3000
Participation Only र. 1000




 
Click here Payment



Note :
Registration fee include conference banquet, proceedings, lunch and other registration materials.
Registration fee is not refundable and also does not include accommodation








 

Contact Us

Contact Person
Mr. Rudresh
Mobile: +91 9663002589
Mr. Arvind
Mobile: +91 9141933636
Venue

||<. =. =. = =. =. =. =. =.Website is under Updation.=. =. = =. =. =. =. =>||
Copyright © TIE 2019
TIE 2019 Website is Customized and Maintained by ROOVEA